With the prosperity of applications such as wearable computing and wireless sensor network, the development of various embedded systems with different functions and implementation forms is required. Since it is difficult to satisfy the requirements of functions, performance, and power consumption in each system by a single computer system, a new development of the system according to the application is required. However, when developing a new SoC (System-on-Chip), large chip size and a huge design cost become a problem. Therefore, in this research, we propose a method to connect standardized small chips using horizontal inductive coupling. By installing coils on each of the horizontally arranged chips, inductive coupling communication of several hundred μm distances is possible and wireless connection between multiple chips is realized. It is not necessary to connect wires between the respective chips, and it is possible to deform the shape with various mounting shapes and sides of the chip as rotation axes. Design chips can be reduced by selecting and combining chips with functions necessary for the system. By the proposed method, it is possible to construct a deformable system having various shapes. Furthermore, by combining the proposed method and the wireless power supply technology, it is possible to realize an entirely new mounting method capable of constructing a system simply by placing chips adjacent to each other without the existence of a wired connection with the outside.
Junichiro Kadomoto, Hidetsugu Irie, Shuichi Sakai: Horizontal Wireless Bus for Free-Form SiP, The Institute of Electornics, Information and Communication Engineers (IEICE), Vol. 118, No. 334, pp. 43–48, Dec., 2018.